According to a market report by Lucintel, the future of the global semiconductor plating system market looks promising with opportunities in the TSV, copper pillar, redistribution layer (RDL), under bump metallization (UBM), and bumping markets. The global semiconductor plating system market is expected to reach an estimated $7.4 billion by 2030 with a CAGR of 4.5% from 2024 to 2030. The major drivers for this market are the increasing penetration of electronic components in the automotive sector, surge in the demand for semiconductors, and utilization of copper plating has seen an upswing.A more than 150-page report to understand trends, opportunity and forecast in semiconductor plating system market to 2030 by type (fully automatic, semi-automatic, and manual), technology (electroplating and electroless), wafer size (up to 100 mm, 100 mm - 200 mm, and above 200 mm), application (TSV, copper pillar, redistribution layer (RDL), under bump metallization (UBM), bumping, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that fully automatic is expected to witness highest growth over the forecast period.
Within this market, redistribution layer (RDL) will remain the largest segment.
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APAC is expected to witness highest growth over the forecast period.
ACM Research, Applied Materials, ASMPT, Classone Technology, Ebara Technologies, Hitachi Power Solutions, Lam Research Corporation, Mitmo Semicon Engineering, Rena Technologies, Tanaka Holdings are the major suppliers in the semiconductor plating system market.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or write us at [email protected] To get access of more than 1000 reports at fraction of cost visit Lucintel's Analytics Dashboard.
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Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: [email protected]
Tel. +1-972-636-5056
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